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    China’s chip capabilities just 3 years behind TSMC, teardown shows

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    TOKYO — An analysis of China’s current semiconductor technology revealed that the country is approaching a level three years behind industry leader Taiwan Semiconductor Manufacturing Co., showing the limitations of U.S. efforts to stem Beijing’s development of cutting-edge chips.

    Hiroharu Shimizu, CEO of Tokyo-based TechanaLye, a semiconductor research company that disassembles 100 electronic devices a year, told Nikkei about China’s capabilities.

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